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Hong Kong Parkeli United Development Co.,Ltd.
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Parkeli 에서 고객님의 필요한제품을 공급하여 드립니다. 저희 판매팀에 연락을 주면 상세한 정보을 받을수있습니다.
HOT SALE for Tyco parts
Tyco Hot Sale   Parkeli - 고객님의 제일좋은 Tyco 공급원
  • 아시아에서 제일 경쟁력있는 가격으로 Tyco 전부제품 공급
  • 제일 ?은 납기로 공급
  • 소량샘플 신청가능합니다
  • 직접 원공장에서 제품을 받아드리기에 기타비용 없습니다
?은 시간내로 비용을 낮추려면 Parkeli을 선택하여 주십시오!
1.  Active Components
  • MCU
  • Memory, flash, EPROM
  • DC/DC Converter
  • CMOS Logic IC
  • Diodes (comercial, IC---components standard)
  • Transistor (comercial, IC---components standard)
  Active Components
협력업체
Brand
Best Offer....
Part Number Description Manufacturer Applications
AT45DB081D-SU Flash AtmelATMEL
TEMIC 카드 예 두꺼운 IC 카드,얇은 IC카드,등기장비용 IC카드,계량기기용IC카드 등
AT45DB321D-SU Flash AtmelATMEL
AT45DB041D-SU Flash AtmelATMEL
ATMEGA8535-16AU Flash AtmelATMEL
AT24C01A Flash AtmelATMEL
AT24C16 Flash AtmelATMEL
ATTINV24-20SSU Flash AtmelATMEL
C8051F321 C805 MPU Silicon LabsSilicon Labs
C8051 시리즈용 계량기, 예 3단 계량기,의료기기,등등
C8051F206 C805 MPU Silicon LabsSilicon Labs
C8051F220/1/6 C805 MPU Silicon LabsSilicon Labs
C8051F230/1/6 C805 MPU Silicon LabsSilicon Labs
C8051F040 C805 MPU Silicon LabsSilicon Labs
C8051F120 C805 MPU Silicon LabsSilicon Labs
이외등등...
2.  수동형 부품
Passive components  
  • 콘덴서
    1. 세라믹콘덴서
    2. 알루미늄 전해 커피시터
    3. 칩탄탈
    4. 칩탄탈
    5. Polyester Film Capacitors
    6. Service Capacitors
  • 저항
    1. 칩저항
    2. 네트워크 저항
    3. 저항
    4. 카본 필름 레지스터
  • 인덕터
    1. Multilayer Chip Inductors
    2. Multilayer Chip Beads
    3. Power Inductors
  • 크리스탈
    1. 크리스탈 오실레이터
    2. VCXO
    3. SMD크리스탈
  • Relay
    적용 일반 제어,통신,전력 시스템하고 자동화.
협력업체
Brand
이외등등...
3.  Connectors, Switch, Cable
  • Connector
    1. IDC Socket Connector
    2. Wire to Board Connector
    3. Pin Header (2.54mm, 2.00mm, 1.27mm)
    4. Female PCB Connector (2.54mm, 2.00mm, 1.27mm)
    5. Board To Board Connector (0.8mm, 0.5mm)
    6. PC Board Mounting (3.96mm)
    7. IDC Header Connector
    8. Surface Mount (SMT) PLCC Socket
    9. FPC/FFC Connector
    10. D-Sub Connector Series
  • Switch
    1. Phone jacks series
    2. DC Power jacks series
    3. AC Power jacks series
    4. AV Pin jacks board series
    5. Tact switch series
    6. Power switch series
    7. USB Jacks series
  • Cable assembling

Conectors Cable
협력업체:
Brand
이외등등...
4.  Bare PCB and PCB AssemblingPCB factory
Bare PCB   •  Bare PCB factory
Having four circuit board factories, we can supply double-sided, multiple layers PCB as well as FPC PCB. Our products met the standard certificate of American UL in 2002, and got the attestation of ISO9002 in 2000. We have the strong high-tech ability and QC ability, as well as a great and wide reputation in this field.
Printed Circuits Board Capabilities
Item Production
Max Layer Count 18
Max Board Thickness 0.175
Min Board Thickness 0.014
Drill to Metal 0.008
Innerlayer Registration +/- 0.003
Line Width/Spacing, Outer/Inner (17 micron) 0.003 / 0.003
Aspect Ratio </= 8:1
Min QFP Pitch (not HASL) 0.016
Controlled Impedance(Single ended) 50 - 90 ohms +/- 8%*
(Differential) 100 - 155 ohms +/- 10%*
Max Internal Copper Wt. 6 oz
HDI(1+N+1 Max Layer Count)
    -Min Via Size		 0.004
Min Capture Pad Size 0.012
•  PCB factory
PCBA electronic manufacturer with its core product SMT, It has a standard workshop of 20,000 square meters, and a staff of nearly 1500 , It built 12 high speed SMT production lines and 2 assembly lines. All our products meet the ROHS requirements of European Union.		   PCBA
5.  Bom kitting and One-Station Solution
BOM Kitting  
Kitting your Bom and offer you all-around one-station Solution; Be your most powerful supplier chain and save your time and energy; Increase your competence to earn the largest benefit.


6.  Obsolete, urgent and hard-to-find components

Source even obsolete and phased out parts at very competitive prices with high quality and prompt delivery.
  Source
7.  IC Test and Evaluation
Test and Evaluation  
  1. IC Test and Evaluation Engineering
  2. Destructive Physical Analysis(DPA)
  3. High/ Low Temperature and Humidity Test
  4. Thermal Shock Test
  5. IC Weatherometer Analysis
  6. IC Life Cycle Testing
  7. IC Durability Testing
  8. Make the Fixture to the IC tester, and IC Test Program Development Service
  9. Sample Die Package and Bonding
  10. Chemical Decapsulation Process and Dyeing Marking, take the IC Layout Photo
  11. ESD and Latch-ip Testing
  12. FIB (Focused Ion Beam) maintain the microcircuit in chip
  13. WEEE /RoHS Test and Analysis

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